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This photo shows a microscopic image of a thin glass interposer used in a new generation of stacked "3-D" integrated circuits, made by Triton.
The future of electronics may be up, instead of out. And that's a good direction for a local company vying to be part of perhaps the next big thing in electronics: so-called 3-D circuit design.
A researcher removes silicon wafers from a solution at the SRC Engineering Research Center at the University of Arizona.
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